FPC Related Product
Halogen-free Series
Adhesiveless Series
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Hardening/Anti-Glare
Anti-Fog Film
Nanometer Organic Automobile IR-Cut Film
Architecture Window Film
PV module backsheet

 

 

 

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HOME / Product Introduction / Halogen free Series

   
 
 
Characteristics
1.

Composed of PI film and Cu foil, with good balanced properties
2. High Tg, with excellent heat endurance and mechanical property
3. Good dimensional stability after applying heat
4. Low moisture absorption and excellent moisture and heat endurance
5. Has exceptional dielectric property
6. ED Cu has the combination of high flexural endurance and low profile property
7. UL certified (File No. :E193078)
8. Pass RoHS Requirements
  General property

Item

Condition

Unit

2LPSE 1005

2LPSE 0505

Test Method

Structure

─

─
RA (18μm)
PI (25μm)
RA (18μm)
PI (12μm)

─

Thickness

─

μm

43

30

─

Peel Strength

A

Kgf/cm

>1.0

>0.7

IPC-TM-650 NO.2.4.9

E－240/150

>1.0

>0.7

C－240/85/85

>1.0

>0.7

100℃ Degree Condition

>1.0

>0.7

 

Dimensional Stability

 

MD

After etching

%

<0.050

IPC-TM-650 NO.2.2.4

TD

<0.050

MD

E－0.5/150

<0.100

TD

<0.100

MD

E－0.5/250

<0.100

TD

<0.100

Solder Float

A

─

300℃/ 60sec

IPC-TM-650 NO.2.4.13

Flexural Endurance

MD

A

Times

>500

>5000

JIS6471

(0.8R、0.5kg)

TD

>500

>5000

Dielectric Constant

A

─

3.65

IPC-TM-650 NO.2.5.5.3

Dissipation Factor

A

─

0.009

Insulation Resistance

A

Ω

>1.0×10 E14

IPC-TM-650 NO.2.6.3.2

C－240/85/85

>1.0×10 E14

Moisture Absorption

D－24 / 23

%

1.35

IPC-TM-650 NO.2.6.2

Dynamic Mechanical Analysis

A

℃

320

DMA

Thermo Mechanical Analysis

100-200℃

ppm/℃

25

TMA

Flammability

A

─

V-0

UL94

＊＊ Property value is the representative value, not standard value。

Item

Condition

Unit

2LPSE 0805

2LPSE 1010

Test Method

Structure

─

─
RA (18μm)
PI (20μm)
RA (35μm)
PI (25μm)

─

Thickness

─

μm

38

60

─

Peel Strength

A

Kgf/cm

>1.0

>1.0

IPC-TM-650 NO.2.4.9

E－240/150

>1.0

>1.0

C－240/85/85

>1.0

>1.0

100℃ Degree Condition

>1.0

>1.0

 

Dimensional Stability

 

MD

After etching

%

<0.050

IPC-TM-650 NO.2.2.4

TD

<0.050

MD

E－0.5/150

<0.100

TD

<0.100

MD

E－0.5/250

<0.100

TD

<0.100

Solder Float

A

─

300℃/ 60sec

IPC-TM-650 NO.2.4.13

Flexural Endurance

MD

A

Times

>5000

>500

JIS6471

(0.8R、0.5 kg)

TD

>5000

>500

Dielectric Constant

A

─

3.65

IPC-TM-650 NO.2.5.5.3

Dissipation Factor

A

─

0.009

Insulation Resistance

A

Ω

>1.0×10E14

IPC-TM-650 NO.2.6.3.2

C－240/85/85

>1.0×10E14

Moisture Absorption

D－24 / 23

%

1.35

IPC-TM-650 NO.2.6.2

Dynamic Mechanical Analysis

A

℃

320

DMA

Thermo Mechanical Analysis

100-200℃

ppm/℃

25

TMA

Flammability

A

─

V-0

UL94

＊＊ Property value is the representative value, not standard value。

 
   
 
Characteristics
1.

Composed of PI film and Cu foil, with good balanced properties
2. High Tg, with excellent heat endurance and mechanical property
3. Good dimensional stability after applying heat
4. Low moisture absorption and excellent moisture and heat endurance
5. Has exceptional dielectric property
6. ED Cu has the combination of high flexural endurance and low profile property
7. UL certified (File No. :E193078)
8. Pass RoHS Requirements
 

General property

Item

Condition

Unit

2LPSR 1005

2LPSR 0505

Test Method

Structure

─

─
RA (18μm)
PI (25μm)
RA (18μm)
PI (12μm)

─

Thickness

─

μm

43

30

─

Peel Strength

A

Kgf/cm

>0.6

>0.5

IPC-TM-650 NO.2.4.9

E－240/150

>0.6

>0.5

C－240/85/85

>0.6

>0.5

100℃ Degree Condition

>0.6

>0.5

 

Dimensional Stability

 

MD

After etching

%

<0.050

IPC-TM-650 NO.2.2.4

TD

<0.050

MD

E－0.5/150

<0.100

TD

<0.100

MD

E－0.5/250

<0.100

TD

<0.100

Solder Float

A

─

300℃/ 60sec

IPC-TM-650 NO.2.4.13

Flexural Endurance

MD

A

Times

>1000

>5000

JIS6471

(0.8R、0.5 kg)

TD

>1000

>5000

Dielectric Constant

A

─

3.65

PC-TM-650 NO.2.5.5.3

Dissipation Factor

A

─

0.009

Insulation Resistance

A

Ω

>1.0×10E14

IPC-TM-650 NO.2.6.3.2

C－240/85/85

>1.0×10E14

Moisture Absorption

D－24 / 23

%

1.35

IPC-TM-650 NO.2.6.2

Dynamic Mechanical Analysis

A

℃

320

DMA

Thermo Mechanical Analysis

100-200℃

ppm/℃

25

TMA

Flammability

A

─

V-0

UL94

＊＊ Property value is the representative value, not standard value。

Item

Condition

Unit

2LPSR 0805

2LPSR 1010

Test Method

Structure

─

─
RA (18μm)
PI (20μm)
RA(35μm)
PI (25μm)

─

Thickness

─

μm

38

60

─

Peel Strength

A

Kgf/cm

>0.6

>0.6

IPC-TM-650 NO.2.4.9

E－240/150

>0.6

>0.6

C－240/85/85

>0.6

>0.6

100℃ Degree Condition

>0.6

>0.6

 

Dimensional Stability

 

MD

After etching

%

<0.050

IPC-TM-650 NO.2.2.4

TD

<0.050

MD

E－0.5/150

<0.100

TD

<0.100

MD

E－0.5/250

<0.100

TD

<0.100

Solder Float

A

─

300℃/ 60sec

IPC-TM-650 NO.2.4.13

Flexural Endurance

MD

A

Times

>5000

>500

JIS6471

(0.8R、0.5 kg)

TD

>5000

>500

Dielectric Constant

A

─

3.65

PC-TM-650 NO.2.5.5.3

Dissipation Factor

A

─

0.009

Insulation Resistance

A

Ω

>1.0×10E14

IPC-TM-650 NO.2.6.3.2

C－240/85/85

>1.0×10E14

Moisture Absorption

D－24 / 23

%

1.35

IPC-TM-650 NO.2.6.2

Dynamic Mechanical Analysis

A

℃

320

DMA

Thermo Mechanical Analysis

100-200℃

ppm/℃

25

TMA

Flammability

A

─

V-0

UL94

＊＊ Property value is the representative value, not standard value。

 



Taiflex Scientific co., Ltd.     
Tel : 886-7-813-9989 Fax : 886-7-813-9971     E-mail : taiflex@taiflex.com.tw
No 1. Circle 3rd Rd., K.E.P.Z., Kaohsiung , 806 Taiwan
Linkou Address:
6F.,NO.203,Gongyuan Rd.,Linkou Township,Taipei County 244, Taiwan(R.O.C)
Tel: 02-2600-6521 Fax: 02-2608-2678
China Address:
Kun-san Taiflex Electronic Material Co., Ltd.
No.1 TaiHong Road WuSongJiang Industry Park,Yushan Town,Kunshan City, JiangSu Province China
TEL: 86-512-57561168 FAX:86-512-57562266