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HOME / Product Introduction / Halogen free Series

   
 
 
1. Halogen-free single-sided FCCL / RA
2. Halogen-free double-sided FCCL/ RA
3. Halogen-free Cover Layer
4.

Halogen-free PI Stiffener
5.

Halogen-free (Bonding Sheet)
  1. Halogen free Single-sided FCCL / RA :
 
Product Properties :
1. Halogen and Stibium free
2. Good Migration Ability
3. Good Dimensional Stability
4. UL–94V0 certified
5. Pass RoHS Requirements

Product Number THKS050513
Cu 1/ 2 OZ
AD 13 um
PI 1/2 mil
THKS100520
Cu 1/2 OZ
AD 20 um
PI 1 mil
THKS101020
Cu 1 OZ
AD 20 um
PI 1 mil
Product Properties unit

Peel strength (kgf/cm)

 A ≧0.5 ≧0.7 ≧0.7
MIT(0.8*0.5kg) Times ≧500 ≧150 ≧200

Dimensional Stability(%)

 MD ≦±0.2 ≦±0.2 ≦±0.2
TD ≦±0.2 ≦±0.2 ≦±0.2

Solder Float Resistance

 300℃×10sec 300℃×10sec 300℃×10sec 300℃×10sec
Insulation Resistance R 1.0E+11 1.0E+11 1.0E+11
RS(Ω) 1.0E+14 1.0E+14 1.0E+14
RV(Ωcm) 1.0E+15 1.0E+15 1.0E+15
Flammability 94-V0 PASS PASS PASS
Chemical Resistance 10%HCl OK OK OK
10%NaOH OK OK OK
Acton OK OK OK
IPA OK OK OK
Dichloromethane OK OK OK
Dichloroethane OK OK OK
  2. Halogen free Double-sided FCCL/RA :
 
Product Properties :
1. Halogen and Stibium free
2. Good Migration Ability
3. Good Dimensional Stability
4. Pending UL–94V0 Certification
5. Pass RoHS Requirements

Product Number THKD050513
Cu 1/2 OZ
AD 13 um
PI 1/2 mil
AD 13mm
Cu 1/2 oz
THKD100520
Cu 1/2 OZ
AD 20 um
PI   1 mil
AD 20mm
Cu 1/2 oz
THKD101020
Cu 1 OZ
AD 20 um
PI 1 mil
AD 20mm
Cu 1 oz
Product Properties unit

Peel strength (kgf/cm)

 A ≧0.5 ≧0.7 ≧0.7
MIT(0.8*0.5kg) Times ≧500 ≧150 ≧200

Dimensional Stability(%)

 MD ≦±0.2 ≦±0.2 ≦±0.2
TD ≦±0.2 ≦±0.2 ≦±0.2

Solder Float Resistance

   300℃×10sec 300℃×10sec 300℃×10sec
Insulation Resistance R(Ω) 1.0E+11 1.0E+11 1.0E+11
RS(Ω) 1.0E+14 1.0E+14 1.0E+14
RV(Ωcm) 1.0E+15 1.0E+15 1.0E+15
Flammability 94-V0 PASS PASS PASS
Chemical Resistance 10%HCl OK OK OK
10%NaOH OK OK OK
Acton OK OK OK
IPA OK OK OK
Dichloromethane OK OK OK
Dichloroethane OK OK OK
  3. Halogen free Cover Layer :
 
Product Properties :
1. Halogen and Stibium free
2. Good Dimensional Stability
3. Pending UL–94V0 Certification
4. Pass RoHS Requirements

Product Number FHK0515
PI 1/2 mil
AD 15um
Release Paper
FHK0525
PI 1/2 mil
AD 25um
Release Paper
Product Properties unit

Product Thickness

um

27

38

Resin Flow

mm

< 0.2

< 0.2

Peel Strength
(90 Degree Peel)

Kgf/cm

≧0.7

≧0.9

Solder Float Resistance

 

300℃/10sec

300℃/10sec

Insulation Resistance

Ω

 Rs1 × 1012 Rs1 × 1012
Rv1 × 1014 Rv1 × 1014

Shelf Life

Month 0℃/ 6 Month 0℃/ 6 Month
10℃/ 3 Month 10℃/ 3 Month

Dimensional Stability

MD%

± 0.2

± 0.2

TD%

± 0.2

± 0.2

Flammability

94-V0

Pass

Pass

Product Number FHK1025
PI 1 mil
AD 25um
Release Paper
FHK1035
PI 1 mil
AD 35um
Release Paper
Product Properties unit

Product Thickness

um

50

60

Resin Flow

mm

< 0.2

< 0.2

Peel Strength
(90 Degree Peel)

Kgf/cm

≧1.0

≧1.0

Solder Float Resistance

 

300℃/10sec

300℃/10sec

Insulation Resistance

Ω

 Rs1 × 1012 Rs1 × 1012
Rv1 × 1014 Rv1 × 1014

Shelf Life

Month 0℃/ 6 Month 0℃/ 6 Month
10℃/ 3 Month 10℃/ 3 Month

Dimensional Stability

MD%

± 0.2

± 0.2

TD%

± 0.2

± 0.2

Flammability

94-V0

Pass

Pass
＊ Special specification and inquiry, please contact Taiflex Scientific sales office.
Lamination material: laminate with 35um of copper foil on the drum side
  4. Halogen free Stiffener :
 
Product Properties :
1. Excellent Peel Strength
2. Good Thermo-Stability
3. Halogen Free
4. Pass RoHS Requirements

Product Number

RHT2025AL  
PI 50 um
AD 25um
Release Material
RHT5025AL
PI Composite Material125 um
AD 25um
Release Material
RHT7025AL
PI Composite Material175 um
AD 25um
Release Material
Product Properties unit

Peel Strength (180 Degree Peel)

PI Side Peel

≧1.0

≧1.0

≧1.0

Copper Side Peel

≧1.0

≧1.0

≧1.0

Solder Float Resistance

 

300℃×30sec

300℃×30sec

300℃×30sec

Resin Flow

mm

<0.3

<0.3

<0.3

Product Thickness

um

75

150

190

Electrical Characteristics

Volume Resistance (Ω)

>1.0E+12

>1.0E+12

>1.0E+12

Surface Resistance (Ωcm)

>1.0E+14

>1.0E+14

>1.0E+14

Product Number RHT8025
PI 200 um
AD 25um
Release Material
RHT9025
PI Composite Material225 um
AD 25um
Release Material
Product Properties unit

Peel Strength (180 Degree Peel)

PI Side Peel

≧1.0 ≧1.0

Copper Side Peel

≧1.0 ≧1.0

Solder Float Resistance

 

 300℃×30sec 300℃×30sec

Resin Flow

mm

 <0.3 <0.3

Product Thickness

um

 225 250

Electrical Characteristics

Volume Resistance (Ω)

 1.0E+12 1.0E+12

Surface Resistance (Ωcm)

 1.0E+14 1.0E+14

 
  5. Halogen free Bonding Sheet(Bonding sheet) :
 
Product Properties :
1. Good Release Operation
2. Low Resin Flow
3. Halogen Free
4. Pass RoHS Requirements

Product Number BH10
Release Film
AD 10um
Release Paper
BH15
Release Film
AD 15um
Release Paper
Product Properties Unit
Product Thickness um 10 15
Resin Flow mm 0.1 0.1
Peel Strength (90 Degree Peel) Kgf/cm ≧1.0 ≧1.0
Solder Float Resistance   300℃/60sec 300℃/60sec
Insulation Resistance Ω Rs1 × 1012 Rs1 × 1012
Rv1 × 1014 Rv1 × 1014
Shelf Life Month 0℃/ 6 Month 0℃/ 6 Month
10℃/ 3 Month 10℃/ 3 Month

Product Number BH25
Release Film
AD 25um
Release Paper
BH50
Release Film
AD 50um
Release Paper
Product Properties Unit
Product Thickness um 25 50
Resin Flow mm 0.1 0.1
Peel Strength (90 Degree Peel) Kgf/cm ≧1.0 ≧1.0
Solder Float Resistance   300℃/60sec 300℃/60sec
Insulation Resistance Ω Rs1 × 1012 Rs1 × 1012
Rv1 × 1014 Rv1 × 1014
Shelf Life Month 0℃/ 6 Month 0℃/ 6 Month
10℃/ 3 Month 10℃/ 3 Month

 



Taiflex Scientific co., Ltd.     
Tel : 886-7-813-9989 Fax : 886-7-813-9971     E-mail : taiflex@taiflex.com.tw
No 1. Circle 3rd Rd., K.E.P.Z., Kaohsiung , 806 Taiwan
Linkou Address:
6F.,NO.203,Gongyuan Rd.,Linkou Township,Taipei County 244, Taiwan(R.O.C)
Tel: 02-2600-6521 Fax: 02-2608-2678
China Address:
Kun-san Taiflex Electronic Material Co., Ltd.
No.1 TaiHong Road WuSongJiang Industry Park,Yushan Town,Kunshan City, JiangSu Province China
TEL: 86-512-57561168 FAX:86-512-57562266